Speedline Technologies provides a comprehensive line of assembly equipment solutions for the following processes and applications:

Circuit Board Printing and Dispensing – With more than 5,000 installations worldwide, Speedline Technologies is the world’s leading supplier of stencil printing and dispensing technology. The company’s stencil printing equipment provides a highly reliable, fast and accurate means of applying solder paste and other PCB materials. In addition, Speedline Technologies provides a variety of dispensing systems for applying solder paste, adhesives, fluxes and conductive epoxies. Wave Soldering – Speedline Technologies re-defined the wave soldering assembly process with the introduction of Lambda Wave. Today, Speedline offers the most sophisticated range of wave soldering technologies for both through-hole and SMT assembly requirements.

Reflow Ovens – Speedline Technologies has led the surface mount assembly market with the introduction of a series of reflow soldering systems that create many of the leading SMT and hybrid assembly products in use today. The company’s reflow ovens are designed to accommodate both surface mount assembly and new semiconductor packaging requirements.

Circuit Board Cleaning – Speedline's in-line, batch and centrifugal cleaning systems provide a range of solutions for both water and solvent-based removal of flux and residue.

Direct Chip Attach and Underfill – Speedline's dispensing equipment provides new approaches to surface mounting and component protection. Precision attachment of bare die using conductive adhesives, chip-on-board, or dam-and-fill encapsulation, and flip-chip underfill dispensing for environmental and thermal protection of die or chip packages.

Wafer Bumping – Manufacturers worldwide are embracing Ball Grid Array (BGA) and Chip Scale Packaging (CSP) technologies to manage increasingly smaller, more dense SMT and semiconductor packaging requirements. Responding to this challenge, Speedline has engineered a number of innovative solutions, including a wafer bump printing system.

Semiconductor Packaging and Encapsulation – Speedline's dispensing technology is engineered for the broadest range of component, semiconductor and hybrid assembly packaging applications. The company offers equipment designed to dispense solder paste onto IC substrates, circuit boards and wafers at high throughput rates.

Services - Speedline Technologies provides a wide variety of after-market service offerings to Speedline's customers. These services include: on-site service, customized service offerings and extended warranties, spare parts, instructor-based training, software and hardware upgrades.